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HTC
Please
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FX30
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to request more information.
ULtra
The Poly-Flow Ultra Cleaning Systems are capable of cleaning a wide
variety of products from 2 ½” x 2 ½” chip trays to 300 mm FOUPs and FOSBs
with outstanding through-put. The most common applications include; wafer
carriers and boxes, process cassettes, reticle pods and boxes, SMIF Pods
and Disk Shippers. All systems are fully customizable to allow great
flexibility. Advanced ultrasonic and vacuum dry chambers are available.
Please
click here
to request more information.
NU
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click here
to request more information. |
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